FIXING MECHANISM OF PLATE

• Main Authors: ISHIKURA YOSHIFUMI, KAMAKURA MITSUTOSHI
• Format: Patent
• Language: English
• Published: 02.04.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To solve a problem that although a heater plate to heat and hold a semiconductor package and to die-bond a semiconductor chip, and a heater block having a heater built-in and capable of heating at an optional temperature are conventionally fastened in the longitudinal direction with a screw, the screw seizes in a hole and the screw cannot be turned and collapses in some cases because the heater plate must be replaced when the kind of a semiconductor element is changed, and because the temperatures of the heater plate and the heater block rise high. SOLUTION: The heater block and the heater plate are fabricated of materials different in thermal expansion coefficient. A protrusion is formed on either of the upper surface of the heater block or the bottom surface of the heater plate and on the member having a higher thermal expansion coefficient; a recess is formed thereon and on the member having a lower thermal expansion coefficient; and if the recess and the protrusion are engaged with a slight gap at ordinary temperature, and heated, the recess and the protrusion expand to exert a compression stress to the engaging part. COPYRIGHT: (C)2009,JPO&INPIT