METHOD FOR FORMING CONDUCTIVE FILM PATTERN

PROBLEM TO BE SOLVED: To provide a method for forming a conductive film pattern which can form a micro conductive film pattern accurately without using a deposition process in a vacuum or a photolithography method. SOLUTION: After a wettability pattern comprising a high wettability region which is h...

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Bibliographic Details
Main Author TSUZUKI SAIICHI
Format Patent
LanguageEnglish
Published 02.04.2009
Subjects
ADVERTISING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CRYPTOGRAPHY
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
LABELS OR NAME-PLATES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
PRINTED CIRCUITS
SEALS
SIGNS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Summary:PROBLEM TO BE SOLVED: To provide a method for forming a conductive film pattern which can form a micro conductive film pattern accurately without using a deposition process in a vacuum or a photolithography method. SOLUTION: After a wettability pattern comprising a high wettability region which is high in wettability relative to an ink for a conductive film and a low wettability region having low wettability is formed on a substrate, the ink for the conductive film is coated by an ink jet system to form the conductive film on the high wettability region. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070237850