METHOD OF MANUFACTURING ELECTRONIC COMPONENT PACKAGE

• Main Authors: SASAKI YOSHITAKA, SHIMIZU TATSUJI
• Format: Patent
• Language: English
• Published: 26.03.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To mass produce laminated type electronic component packages capable of high integration with accuracy and with ease. SOLUTION: An electronic component package 1 has: a main body including a plurality of laminated layer parts each of which has a side surface, and having a side surface including the side surfaces of the plurality of layer parts; and a wiring 3 arranged on the side surface of the main body. Each layer part has at least one electronic component chip, and a plurality of electrodes arranged on the side surface of the layer part. This method of manufacturing the electronic component package 1 includes the steps of fabricating a main body aggregate 160 including a plurality of planned main body parts each of which is to become the main body later, the planned main body parts being arranged in one direction orthogonal to a direction of lamination of the plurality of layer parts; forming the wiring 3 for each of the planned main body parts 2P of the main body aggregate 160; and cutting the main body aggregate 160 after the formation of the wiring 3 so as to separate the plurality of planned main body parts 2P from each other so that each of them becomes the main body to form a plurality of electronic component packages. COPYRIGHT: (C)2009,JPO&INPIT