Ni PLATING BATH

PROBLEM TO BE SOLVED: To provide a nickel plating bath which is excellent in uniform electrodeposition properties and does not use boron and with which plating cost is reduced. SOLUTION: The nickel plating bath contains, as a nickel ion source, nickel chloride and/or nickel sulfate in a concentratio...

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Bibliographic Details
Main Authors ITO TAKU, ITO TAKESHI
Format Patent
LanguageEnglish
Published 26.03.2009
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PROBLEM TO BE SOLVED: To provide a nickel plating bath which is excellent in uniform electrodeposition properties and does not use boron and with which plating cost is reduced. SOLUTION: The nickel plating bath contains, as a nickel ion source, nickel chloride and/or nickel sulfate in a concentration of 1-20 g/L expressed in terms of nickel ion and citric acid in a concentration of 50-300 g/L expressed in terms of citric acid monohydrate, and is controlled to have a pH of 6.5-10 by the addition of ammonia. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070231095