SOLDER MOLD HAVING GROOVE FOR VENTILATION, METHOD FOR FORMING AND USING THE MOULD

PROBLEM TO BE SOLVED: To provide a solder mold for transferring solder to a wafer. SOLUTION: A solder mold is provided with a base plate, a plurality of depressions for holding solder installed thereon, and a plurality of grooves for ventilation formed on the base plate and mutually connecting the p...

Full description

Saved in:
Bibliographic Details
Main Authors RASCHID JOSE BEZAMA, IVAN GEORGE COLGAN, PETER ALFRED GRUBER, OBERSON VALERIE ANNE, RUSSELL ALAN BUDD
Format Patent
LanguageEnglish
Published 26.02.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a solder mold for transferring solder to a wafer. SOLUTION: A solder mold is provided with a base plate, a plurality of depressions for holding solder installed thereon, and a plurality of grooves for ventilation formed on the base plate and mutually connecting the plurality of depressions for holding solder. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20080197549