LIQUID CURABLE COMPOSITION AND CURED PRODUCT THEREOF

PROBLEM TO BE SOLVED: To provide a curable composition which has satisfactory curing property, low viscosity, and high curing rate, can provide satisfactory surface hardness and adhesion to a substrate of a cured coating film, and further causes no shrinkage on curing. SOLUTION: The liquid curable c...

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Bibliographic Details
Main Authors SAWADA GORO, MARUYAMA ISAO, KAMATA AMI, HABA KAZUHIKO
Format Patent
LanguageEnglish
Published 26.02.2009
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a curable composition which has satisfactory curing property, low viscosity, and high curing rate, can provide satisfactory surface hardness and adhesion to a substrate of a cured coating film, and further causes no shrinkage on curing. SOLUTION: The liquid curable composition comprises the following components (A), (B) and (C): (A) an epoxy resin; (B) an oxetane compound having a vinyl ether group represented by the general formula (1), wherein R1represents a hydrogen atom or 1-4C alkyl group, and R2represents 1-4C alkylene group which may include ether linkage; and (C) a cationic polymerization initiator. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20080007860