POLISHING DEVICE

PROBLEM TO BE SOLVED: To provide a polishing device capable of putting a polishing tape on the whole of a notch of a substrate, and the pad of which does not slip sideway with respect to the polishing tape. SOLUTION: This polishing device has a substrate holding part to hold the substrate W, a tape...

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Bibliographic Details
Main Authors ITO KENYA, KUSA HIROAKI, TAKAHASHI YOSHIMIZU, SEKI MASAYA
Format Patent
LanguageEnglish
Published 26.02.2009
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a polishing device capable of putting a polishing tape on the whole of a notch of a substrate, and the pad of which does not slip sideway with respect to the polishing tape. SOLUTION: This polishing device has a substrate holding part to hold the substrate W, a tape feeding mechanism 43 to feed the polishing tape 41 in the longitudinal direction and a polishing head 42 to pressurize the polishing tape to the notch of the substrate. The polishing head 42 has two guide members 57a, 57b to guide the advancing direction of the polishing tape and the back pad 50 having a loop shape arranged on the back side of the polishing tape. The back pad 50 is held by a plurality of pulleys 59a, 59b, 59c, 59d and 59e so as to advance in the longitudinal direction while maintaining the loop shape. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20080161254