SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

• Main Author: YOON JOON-KU
• Format: Patent
• Language: English
• Published: 12.02.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device, which adopts no wiring and no contact for electric connection of a plurality of semiconductor chips, achieving improved fabrication efficiency and reducing fabrication costs thereof, and to provide a method of fabricating the same. SOLUTION: The semiconductor device includes a first semiconductor chip 110 and a second semiconductor chip 120 each having an internal circuit and being bonded opposite each other. The first and the second semiconductor chips 110 and 120 include trenches formed so as to correspond to each other, metal electrodes 122 formed in inner bottom surfaces of the trenches, a liquid-phase conductive material 130 filled inside the trenches, and bonding portions 140 formed in surfaces so as to correspond to each other for bonding the first semiconductor chip and the second semiconductor chip with each other. The liquid-phase conductive material 130 is filled inside a trench space formed by bonding the trenches of the first semiconductor chip 110 and the second semiconductor chip 120. COPYRIGHT: (C)2009,JPO&INPIT