SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To solve a problem that although a J-FET has a distance made larger between a drain region and a gate region than between a source region and the gate region in the case of a striped shape because of a difference in depletion layer width depending upon the relation between a ga...
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Format | Patent |
Language | English |
Published |
12.02.2009
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Abstract | PROBLEM TO BE SOLVED: To solve a problem that although a J-FET has a distance made larger between a drain region and a gate region than between a source region and the gate region in the case of a striped shape because of a difference in depletion layer width depending upon the relation between a gate-source voltage and a drain-source voltage, gate regions are at an equal distance when disposed in a grating shape because of improvement in forward transfer admittance gm, and box area increases for maintaining a breakdown voltage. SOLUTION: A gate region is formed in a net-shaped pattern having a first polygonal shape and a second polygonal shape smaller than the first polygonal shape, and a source region and a drain region are arranged inside the pattern. Consequently, the forward transfer admittance gm can be increased as compared with a structure having gate regions arranged in stripes. Further, while a prescribed breakdown voltage is maintained, deterioration in forward transfer characteristics (amplification characteristics) due to an increase in input capacity Ciss can be minimized as compared with a case wherein gate regions are arranged in a grating shape. COPYRIGHT: (C)2009,JPO&INPIT |
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AbstractList | PROBLEM TO BE SOLVED: To solve a problem that although a J-FET has a distance made larger between a drain region and a gate region than between a source region and the gate region in the case of a striped shape because of a difference in depletion layer width depending upon the relation between a gate-source voltage and a drain-source voltage, gate regions are at an equal distance when disposed in a grating shape because of improvement in forward transfer admittance gm, and box area increases for maintaining a breakdown voltage. SOLUTION: A gate region is formed in a net-shaped pattern having a first polygonal shape and a second polygonal shape smaller than the first polygonal shape, and a source region and a drain region are arranged inside the pattern. Consequently, the forward transfer admittance gm can be increased as compared with a structure having gate regions arranged in stripes. Further, while a prescribed breakdown voltage is maintained, deterioration in forward transfer characteristics (amplification characteristics) due to an increase in input capacity Ciss can be minimized as compared with a case wherein gate regions are arranged in a grating shape. COPYRIGHT: (C)2009,JPO&INPIT |
Author | MATSUMIYA YOSHIAKI HATAMOTO MITSUO |
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RelatedCompanies | SANYO ELECTRIC CO LTD SANYO SEMICONDUCTOR CO LTD |
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Snippet | PROBLEM TO BE SOLVED: To solve a problem that although a J-FET has a distance made larger between a drain region and a gate region than between a source region... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | SEMICONDUCTOR DEVICE |
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