PROBE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a method for manufacturing a probe assembly capable of applying roughly uniform thermal energy to a connection part between a connection pad in a connection pad array or a separated connection pad and a probe by obviating the need of control of laser energy correspon...

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Bibliographic Details
Main Authors YOKOUCHI MASATOSHI, IMAI NORIHIRO, MIKUNI KATSUSHI, TAZAWA MASAHISA
Format Patent
LanguageEnglish
Published 29.01.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PROBLEM TO BE SOLVED: To provide a method for manufacturing a probe assembly capable of applying roughly uniform thermal energy to a connection part between a connection pad in a connection pad array or a separated connection pad and a probe by obviating the need of control of laser energy corresponding to arrangement of the connection pads. SOLUTION: This method for manufacturing the probe assembly is constituted with the use of thermal energy of laser light for connecting the plurality of connection pads provided on a probe substrate to the probes placed on the respective connection pads. A dummy connection pad to which the probe is not to be bonded is formed to a portion in the vicinity of at least one connection pad on the probe substrate in order to make the thermal energy to be uniform, the thermal energy being generated by radiation of laser light to each of the connection pads between the connection pads and the respective probes. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070182383