ADHESIVE COMPOSITION

PROBLEM TO BE SOLVED: To provide an adhesive composition which is capable of offering a sufficient connection reliability and a sufficient adhesion property, even when the electrode width and the electrode interval in a circuit to be connected are extremely narrow, and is capable of sufficiently sup...

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Bibliographic Details
Main Authors KATAYAMA EMI, SUGIURA MINORU
Format Patent
LanguageEnglish
Published 08.01.2009
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
CONDUCTORS
DYES
ELECTRICITY
INSULATORS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide an adhesive composition which is capable of offering a sufficient connection reliability and a sufficient adhesion property, even when the electrode width and the electrode interval in a circuit to be connected are extremely narrow, and is capable of sufficiently suppressing decreases in the connection reliability and the adhesion property, even when it is placed under high-temperature high-humidity conditions for a long period of time. SOLUTION: The adhesive composition contains (A) a urethane resin which has a (meth)acrylate group on its side chain and has a weight average molecular weight of 10,000-500,000 and (B) a hardener which produces free radicals upon exposure to light or heat, provided that (A) the urethane resin contains a copolymer represented by formula (I) (wherein X is a diisocyanate residue; Y is a diol residue; n is an integer of 1-100; and the diol residue represented by Y comprises a specific group in a prescribed ratio). COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070259101