SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To reduce the number of components, to facilitate a manufacturing process, and to reduce parasitic inductance. SOLUTION: A semiconductor device 1 includes a semiconductor chip 4 arranged between opposing radiator plates 2, 3, where the semiconductor chip 4, the radiator plates...

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Bibliographic Details
Main Author SUZUKI MIKIMASA
Format Patent
LanguageEnglish
Published 11.12.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To reduce the number of components, to facilitate a manufacturing process, and to reduce parasitic inductance. SOLUTION: A semiconductor device 1 includes a semiconductor chip 4 arranged between opposing radiator plates 2, 3, where the semiconductor chip 4, the radiator plates 2, 3 are molded with a resin 5. The semiconductor chip 4 is constituted of an IGBT chip incorporating FWD. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070145083