PRESSURE BONDED HEAT PIPE

PROBLEM TO BE SOLVED: To provide a pressure bonded heat pipe superior in heat radiation performance capable of being bonded without increasing the number of members to be used and in a state of storing an operating liquid, and maintaining flatness of a surface of a plate-like member on which an elem...

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Bibliographic Details
Main Author SHIMURA TAKAHIRO
Format Patent
LanguageEnglish
Published 11.12.2008
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Summary:PROBLEM TO BE SOLVED: To provide a pressure bonded heat pipe superior in heat radiation performance capable of being bonded without increasing the number of members to be used and in a state of storing an operating liquid, and maintaining flatness of a surface of a plate-like member on which an element to be cooled is mounted. SOLUTION: The pressure bonded heat pipe is equipped with a container including: an outer periphery pressure welded part formed by air-tightly pressure welding outer peripheral parts of two container materials; a through-hole formed on the inside of the outer periphery pressure welded part of the container materials; a through-hole periphery pressure welded part formed by pressure welding so as to surround the periphery of the through-hole; and a hollow part formed by the outer periphery pressure welded part and the through-hole periphery pressure welded part, that contains a wick material and the operating liquid thereinside. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070148143