LIQUID COOLING SYSTEM

PROBLEM TO BE SOLVED: To solve a conventional problem in which a server module of 1U size cannot be constituted due to enlargement of an air cooling system in response to higher heat generation of CPU or a request for improved mounting density in a rack mount server. SOLUTION: The liquid cooling sys...

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Bibliographic Details
Main Authors ASANO ICHIRO, MATSUSHITA SHINJI, TOIZONO TAKESHI, SAITO KENICHI
Format Patent
LanguageEnglish
Published 27.11.2008
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To solve a conventional problem in which a server module of 1U size cannot be constituted due to enlargement of an air cooling system in response to higher heat generation of CPU or a request for improved mounting density in a rack mount server. SOLUTION: The liquid cooling system for cooling CPU of a server module is adapted to install a jacket for absorbing a generated heat by coolant to the CPU, circulate the coolant by a pump, and release the heat to the outside by a radiator. In the liquid cooling system, the radiator includes a plurality of radiating fin units disposed in the flowing direction of cooling air from a cooling fan according to the heating quantity of the CPU, and coolant circulating passages of the radiating fin units are serially connected. The cooling fan of the liquid cooling system is disposed in the center of the server module to be used both for air cooling of the radiator and for air cooling of other devices. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20080159867