METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: MOCHIZUKI EIJI, IKEDA YOSHINARI, YAMASHITA MITSUO, FUJII TAKASHI, IIZUKA YUJI, YOSHIHARA KATSUHIKO
• Format: Patent
• Language: English
• Published: 06.11.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To improve the reliability of a solder joint between a semiconductor chip and the other composition member, and the reliability of a solder joint between composition materials other than the semiconductor chip. SOLUTION: A solder joint layer 5 is heated and melted in a state that a filler thinner than the solder joint layer 5 before melted is placed on the solder joint layer 5 before melting, and then the solder joint layer 5 is cooled and hardened in a state that the filler drips into the melted solder joint layer 5. This can set the thickness of the solder joint layer 5 with which a heat sink 6 and an insulating substrate 3 are joined to a desired thickness, and makes the filler as a spacer, to reduce distortion generated in the solder joint layer 5. Furthermore, in a similar way in a solder joint between the semiconductor chip and a lead frame and in a solder joint between the insulating substrate 3 and the semiconductor chip, this makes the fillers as spacers in solder joint layers which connect them to each other, to reduce distortion generated in the solder joint layers. COPYRIGHT: (C)2009,JPO&INPIT