SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a COF capable of efficiently radiating heat using a simple structure and a simple manufacturing method, and to provide a method of manufacturing the same. SOLUTION: A semiconductor device of a COF 100 is formed on one principal plane of a flexible substrate 1 having...

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Bibliographic Details
Main Author NAKAJIMA KEIICHI
Format Patent
LanguageEnglish
Published 06.11.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a COF capable of efficiently radiating heat using a simple structure and a simple manufacturing method, and to provide a method of manufacturing the same. SOLUTION: A semiconductor device of a COF 100 is formed on one principal plane of a flexible substrate 1 having no device hole and in which a semiconductor chip 4 is mounted on inner lead wiring. In the semiconductor device, a first resin layer 6 is formed on a position corresponding to a semiconductor chip 4 on a second principal plane of a side opposite to a semiconductor chip 4 mounting side of the flexible substrate 1. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070110177