COVER FOR ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

• Main Authors: KYO TETSUGEN, HANSEN KEN-HOLM
• Format: Patent
• Language: English
• Published: 23.10.2008
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PHYSICS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a cover for an electronic device which is easily assembled, has long service life and less power consumption, and to provide a manufacturing method thereof. SOLUTION: The cover has a structure in which a plastic cover and a display device are integrally formed by injection molding, and the display device is an electronic ink display device. The manufacturing method includes a step of providing an injection molding die in which a first molding portion is formed on the substantial center of a female die, a second molding portion is formed on a male die and a concave portion is formed on the second molding portion; a step of providing the electronic ink display device having the same shape and size as those of the concave portion; a step of mounting the electronic ink display device into the concave portion of the male die; a step of forming a cavity to manufacture the plastic cover by mating the female die with the male die; a step of injecting a thermoplastic resin material into the cavity to form the plastic cover to be formed integrally with the display device; and a step of releasing the molding die to take out the cover for an electronic device after the plastic cover has been cured. COPYRIGHT: (C)2009,JPO&INPIT