Au-Sn ALLOY SOLDER PASTE HAVING REDUCED GENERATION OF VOID

PROBLEM TO BE SOLVED: To provide Sn-Au alloy solder paste having reduced generation of voids. SOLUTION: The solder paste is composed of a mixed body consisting of Au-Sn alloy solder powder having a component comprising, by mass, 14 to 30% Sn and 0.1 to 5% Bi, and further comprising one or two or mor...

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Bibliographic Details
Main Authors OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, MISHIMA TERUSHI
Format Patent
LanguageEnglish
Published 23.10.2008
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide Sn-Au alloy solder paste having reduced generation of voids. SOLUTION: The solder paste is composed of a mixed body consisting of Au-Sn alloy solder powder having a component comprising, by mass, 14 to 30% Sn and 0.1 to 5% Bi, and further comprising one or two or more kinds selected from 0.1 to 5% In and 0.01 to 1% Sb, and the balance Au with inevitable impurities, and flux. The mixed body comprises the flux of 5 to 25%. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070096149