SEMICONDUCTOR MANUFACTURING DEVICE, HEATER-PLATE ATTACHING/DETACHING JIG, AND HEATER-PLATE ATTACHING/DETACHING METHOD

• Main Authors: TAKAMURA KEIJI, ARAKI KAZUNARI
• Format: Patent
• Language: English
• Published: 16.10.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device, a heater-plate attaching/detaching jig, and a heater-plate attaching/detaching method that allow easy and safe attachment/detachment of a heater plate while achieving sufficient fixation and high-precision positioning of the heater plate. SOLUTION: The semiconductor manufacturing device has a heater unit part that is at least provided with a heater block 1 having a heater 2, a heater plate 3 arranged on the heater block 1 so as to allow an object to be heated to be placed thereon, and a pair of levers 9, 10 for pressing the heater plate 3 from both outer sides by a spring force. The upper face of the heater block 1 is provided with positioning pins 4 arrayed along in the pressing direction of the levers and a stepped part 6 formed at the end part on the one-lever side. The lower face of the heater plate 3 is provided with positioning grooves 5 extending along in the pressing direction of the levers so as to be engaged with the positioning pins 4. The upper part of the heater plate 3 is provided with a pair of hooking holes 13 engaged with L-shaped jigs at the tip of a plier. COPYRIGHT: (C)2009,JPO&INPIT