EQUIPMENT AND METHOD FOR AFFIXING SUBSTRATE

PROBLEM TO BE SOLVED: To provide equipment and a method for readily affixing a first substrate and a second substrate for supporting the first substrate with a holding agent. SOLUTION: The equipment 1 for sticking substrates comprises a first holding device 10 for holding a first substrate, i.e., a...

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Bibliographic Details
Main Authors HARUTA YUICHI, YASUDA YOSHITOMO
Format Patent
LanguageEnglish
Published 16.10.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide equipment and a method for readily affixing a first substrate and a second substrate for supporting the first substrate with a holding agent. SOLUTION: The equipment 1 for sticking substrates comprises a first holding device 10 for holding a first substrate, i.e., a wafer 4, and a second holding device 20 for holding the support substrate 6 of a second substrate to be stuck to the first substrate, opposite to the first substrate (the wafer 4) held on the first substrate 10. An irradiation device 31 for irradiating a wafer-holding agent 7, arranged on the substrate in order to stick the substrate with radioactive rays and for melting the wafer holding agent is also provided. The wafer 4 and the support substrate 6 are stuck, by making the wafer holding agent 7 melt by means of the irradiation device 31. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070087186