PHOTOSENSITIVE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having favorable alkali solubility and excellent developing property and providing a coating film excellent in transparency, heat resistance and chemical resistance. SOLUTION: The photosensitive resin composition contains: a polymer...

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Bibliographic Details
Main Authors OGAWA KOSHI, ENDO MITSUO, ICHIKAWA TAKAO
Format Patent
LanguageEnglish
Published 16.10.2008
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having favorable alkali solubility and excellent developing property and providing a coating film excellent in transparency, heat resistance and chemical resistance. SOLUTION: The photosensitive resin composition contains: a polymer [A] having a structural unit (a1) represented by general formula (1) and/or a structural unit (a2) represented by general formula (2); and a radically polymerizable compound [B] having an unsaturated double bond. In the formulae, R1represents a hydrogen atom or a methyl group; R2represents a 1-4C straight-chain or branched alkyl group; and m represents an integer of 0 to 4. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070094204