ULTRASONIC FLAW INSPECTION DEVICE AND METHOD

• Main Authors: KAWARADA YOSHIYUKI, HIRASAWA TAIJI, OTSUBO TORU
• Format: Patent
• Language: English
• Published: 02.10.2008
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

PROBLEM TO BE SOLVED: To efficiently perform flaw inspection at the same probe position with high precision using an ultrasonic beam different in use frequency without changing a probe. SOLUTION: This ultrasonic flaw inspection device includes an array type ultrasonic probe 2 having a plurality of vibrator groups different in use frequency in a symmetrically arranged state; a probe movement regulation part 3 for regulating the movement of the array type ultrasonic probe 2 to a measuring target 1; a flaw inspection condition setting part 8 for setting a flaw inspection condition at every use frequency and vibration group under the preset condition of the measuring target 1; a scanning part 14 for scanning the ultrasonic beam by the array type ultrasonic probe 2; a processing part 15 for processing the ultrasonic echo from the inspection target region of the measuring target 1 obtained by scanning the ultrasonic beam; and an output device 18 for outputting the processing results obtained by the processing part 15. An ultrasonic flaw inspection method using this ultrasonic flaw inspection device is also disclosed. COPYRIGHT: (C)2009,JPO&INPIT