COMPOUND TYPE SOLID-STATE IMAGE PICKUP ELEMENT

PROBLEM TO BE SOLVED: To provide a compact, light compound-type solid-state image pickup element capable of simultaneously capturing two images in the same object. SOLUTION: A first solid-state image pickup element 1 for receiving and photoelectrically converting incident light and a second solid-st...

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Bibliographic Details
Main Author UIE SHINJI
Format Patent
LanguageEnglish
Published 25.09.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a compact, light compound-type solid-state image pickup element capable of simultaneously capturing two images in the same object. SOLUTION: A first solid-state image pickup element 1 for receiving and photoelectrically converting incident light and a second solid-state image pickup element 2 for receiving and photoelectrically converting light through the first solid-state image pickup element 1 are overlapped. At least one of the first and second solid-state image pickup elements 1, 2 is preferably a back irradiation type solid-state image pickup element. Further, the pixel pitch of the second solid-state image pickup element 2 is allowed to be equal to or an integer multiple of that of the first solid-state image pickup element 1 for arrangement and overlapping. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070064971