SUBSTRATE-TREATING APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate treating apparatus capable of reducing a cost on the apparatus and raising through-put in treating a plurality of substrates to be treated concerning the substrate treating apparatus for forming a coating film by drying a treatment liquid, with respect to...

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Bibliographic Details
Main Author KAJIWARA HIRONOBU
Format Patent
LanguageEnglish
Published 18.09.2008
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a substrate treating apparatus capable of reducing a cost on the apparatus and raising through-put in treating a plurality of substrates to be treated concerning the substrate treating apparatus for forming a coating film by drying a treatment liquid, with respect to the substrate to be treated with the treatment liquid coated thereon. SOLUTION: The substrate treating apparatus 50 for forming a coating film by drying a treatment liquid, with respect to the substrate G, to be treated with the treatment liquid coated thereon includes a carrying means 32 for placing the substrate G, to be treated in a dorsal position and carrying the substrate on a carrier passage in a horizontal direction; and chamber units 1, 2, 3 arranged on the carrier passage and drying the substrate carried by the carrying means 32. A drying air flow that contacts the upper surface of the substrate G to be carried is formed in the chamber units 1, 2, 3. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070052199