METHOD OF MANUFACTURING ELECTRONIC COMPONENT PACKAGE, AND WAFER AND BASIC STRUCTURE USED FOR MANUFACTURING ITS ELECTRONIC COMPONENT PACKAGE

• Main Authors: SASAKI YOSHITAKA, SHIMIZU TATSUJI
• Format: Patent
• Language: English
• Published: 28.08.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To inexpensively mass-produce electronic component packages in a short time. SOLUTION: In a method of manufacturing the electronic component package, a wafer 1 is first fabricated which has multiple sets of external connection terminals 11 corresponding to a plurality of electronic component packages and a holding part 15 for holding the multiple sets of external connection terminals 11, and includes a plurality of expected substrate portions 2 to be separated into the substrates of the electronic component packages later. Next, at least one electronic component chip 3 is bonded to each of the expected substrate portions 2 on the wafer 1. Then, the electrodes of the electronic component chips 3 and the external connection terminals 11 are connected to each other. After that, the electronic component chips 3 are sealed. Next, the wafer 1 is cut so as to separate the expected substrate portions 2 into the plurality of substrates. COPYRIGHT: (C)2008,JPO&INPIT