METHOD AND APPARATUS FOR MEASURING THREE DIMENSIONS OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To suppress the decrease in measurement accuracy due to slopes of an electronic component when various dimensions of the electronic component to be mounted are measured. SOLUTION: In a method for measuring three dimensions of the electronic component, the electronic component i...

Full description

Saved in:
Bibliographic Details
Main Authors WAKABAYASHI CHIEKO, KONNO TAKASHI
Format Patent
LanguageEnglish
Published 14.08.2008
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
PRINTED CIRCUITS
TESTING
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To suppress the decrease in measurement accuracy due to slopes of an electronic component when various dimensions of the electronic component to be mounted are measured. SOLUTION: In a method for measuring three dimensions of the electronic component, the electronic component is irradiated with a linear light from under the electronic component to be subjected to light-sectioning line measurement by an imaging means provided below the electronic component, wherein a light projecting unit 26 is rotated just a little to make the light projecting unit 26 parallel to the electronic component 30 in consideration of a minute tilt error of the electronic component 30 sucked to a suction nozzle 10, and a laser linear light 19b is radiated from the light projecting unit 26. Thus, a recognition rate is improved, which also leads to the improvement of accuracy. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070021848