PACKAGE FOR PRESSURE SENSOR, ITS MANUFACTURING METHOD, AND PRESSURE SENSOR

PROBLEM TO BE SOLVED: To provide a package for a pressure sensor and a pressure sensor capable of sensitively detecting external pressure, and a manufacturing method of the package for the pressure sensor. SOLUTION: The package for the pressure sensor includes an insulated structure 1 having an inte...

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Bibliographic Details
Main Authors ICHIKI SHINJI, YAMASHITA SHUHEI, FUKUDA KENJIRO, HASHIGUCHI ISAO
Format Patent
LanguageEnglish
Published 07.08.2008
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Summary:PROBLEM TO BE SOLVED: To provide a package for a pressure sensor and a pressure sensor capable of sensitively detecting external pressure, and a manufacturing method of the package for the pressure sensor. SOLUTION: The package for the pressure sensor includes an insulated structure 1 having an internal space S, and an upper electrode 6 and a lower electrode 5 disposed on the facing upside and downside of an inner wall surface of the internal space S. In the package for the pressure sensor, at least one of the upside and downside of the inner wall surface has a flexible area bending when the pressure from the outside is applied. In the insulated structure 1, a cavity section 7 extending from the internal space S to the outer surface of the insulated structure 1 is formed. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070307098