THREE-DIMENSIONAL MEASURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

• Main Authors: WAKABAYASHI CHIEKO, NEMOTO ETSUO, KONNO TAKASHI, HACHIMAN NAOYUKI
• Format: Patent
• Language: English
• Published: 31.07.2008
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; PRINTED CIRCUITS; TESTING

PROBLEM TO BE SOLVED: To enable a compensation to be performed simply even when line light is curved, during a three-dimensional measurement of an electronic component. SOLUTION: In a three-dimensional measuring method for the electronic component, which photographs an optical cutting-plane line when projecting the line light on the electronic component held by a holding means, and measures a degree of flatness of the electronic component from acquired image data, the line light is projected on a flat reference plate being set on a measurement position, and its optical cutting-plane line is photographed, and its photographed image data and a shift quantity Δw from the corresponding straight line are obtained beforehand, and when measuring the degree of flatness of the electronic component, the photographed image data are compensated from the corresponding shift quantity. COPYRIGHT: (C)2008,JPO&INPIT