OSCILLATOR AND ITS MANUFACTURING METHOD

• Main Author: IKEDA TOMOO
• Format: Patent
• Language: English
• Published: 10.07.2008
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

PROBLEM TO BE SOLVED: To provide a small oscillator having both high reliability excellent in oscillation characteristics and high precision and capable of serving to high frequencies, and to provide a manufacturing method for the oscillator. SOLUTION: The oscillator comprises a thin plate member made of an AT cut crystal and a reinforcement member made of silicon and bonded on a part of one side of the thin plate member. The oscillator is characterized in that a part to which the reinforcement member of the thin plate member does not bond is to vibrate. The manufacturing method comprises the processes of: bonding process for bonding a silicon wafer onto a crystal wafer; thin plate process for processing the thickness of the crystal wafer bonded to the silicon wafer to a desired thickness; etching process for processing the silicon wafer bonded to the crystal wafer by an etching method; electrode formation process for forming an electrode on the crystal wafer; and small piece process for processing the bonded crystal wafer and silicon wafer to the size of the oscillator. COPYRIGHT: (C)2008,JPO&INPIT