METHOD FOR CUTTING BRITTLE MATERIAL

PROBLEM TO BE SOLVED: To provide a method for cutting a brittle material using laser beams which can easily divide a substrate by suppressing the adhesion between cracked surfaces without pollution with a cooling fluid. SOLUTION: The brittle material cutting method includes a process in which the br...

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Bibliographic Details
Main Authors HOTTA TAKAFUMI, JIBIKI SATOSHI
Format Patent
LanguageEnglish
Published 26.06.2008
Subjects
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
GLASS
MACHINE TOOLS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
MINERAL OR SLAG WOOL
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:PROBLEM TO BE SOLVED: To provide a method for cutting a brittle material using laser beams which can easily divide a substrate by suppressing the adhesion between cracked surfaces without pollution with a cooling fluid. SOLUTION: The brittle material cutting method includes a process in which the brittle material with an initial crack formed in advance is irradiated with laser beams while the laser beams are moved relatively with the initial crack as a starting point to form a local heating part on the surface of the brittle material, a process in which a secondary crack is developed from the initial crack by quenching the local heating part by spraying a cooling fluid on it to form a cutting line, a process in which the brittle material is divided by applying mechanical force along the cutting line, and a process in which the adhesion of the secondary crack is prevented after the cutting line is formed. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060331285