MULTI-LAYER WIRING PLATE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a multi-layer wiring plate manufacturing method which can deposit electrolytic metal plating on the outmost conductor layer in an uniform thickness even if conventionally manufacturing a multi-layer wiring plate of a structure which needs to supply a current from the...

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Bibliographic Details
Main Authors KAWAKAMI YUTAKA, TSUBOMATSU YOSHIAKI, SAKURAI TAKEHISA, WAKABAYASHI AKIHIKO, NAMATAME KAZUHIKO
Format Patent
LanguageEnglish
Published 12.06.2008
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a multi-layer wiring plate manufacturing method which can deposit electrolytic metal plating on the outmost conductor layer in an uniform thickness even if conventionally manufacturing a multi-layer wiring plate of a structure which needs to supply a current from the back to a deposited conductor on the surface, or, supply a current from the surface to the deposited conductor on the back, where the plating deposit conductor and a current supplying portion are not the same conductor layer when conducting the electrolytic metal plating in a multi-layer wiring plate manufacturing method having a process of conducting electrolytic metal plating on the outmost conductor layer of a multi-layer wiring plate. SOLUTION: After forming the outmost conductor layer, an inter layer connection portion electrically connecting the outmost conductor layers of surface/back are formed in a non-productive area before the process of conducting the electrolytic metal plating. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070143767