LAMINATE FOR HDD SUSPENSION AND METHOD OF MANUFACTURING THE SAME

• Main Authors: SHIMOSE MAKOTO, OKA SEIGO, KABEMURA ERI, WATANABE TAKASHI, MATSUSHITA SUKEYUKI
• Format: Patent
• Language: English
• Published: 12.06.2008
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INFORMATION STORAGE; INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PHYSICS; PRINTED CIRCUITS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a laminate for use in an HDD suspension that excels in such properties as adhesive strength, heat resistance, flatness, and dimensional stability, and allows fine patterning on an electrically conductive layer and a polyimide resin layer. SOLUTION: The laminate for use in an HDD suspension comprises a stainless steel base material and a polyimide resin layer, where (a) the polyimide resin layer shows a linear expansion coefficient in the range of 1×10-5to 3×10-5/°C, (b) the polyimide based resin layer shows an etching rate of 0.5 μm/min or more when immersed in 100%-hydrated hydrazine at 50°C, (c) the stainless steel base material shows heat shrinkage of 0.025% or less in each of the transverse and longitudinal directions when subjected to heat treatment at 330°C for 30 minutes in air, (d) the stainless steel base material has an average roughness along center line (Ra) of 20 to 300 nm on the surface to be laminated to the polyimide layer, and (e) the stainless steel base material has a thickness in the range of 10 to 30 μm. COPYRIGHT: (C)2008,JPO&INPIT