DEVICE FOR SUPPORTING SUBSTRATE AND DEVICE FOR PROCESSING SUBSTRATE PROVIDED WITH SAME

PROBLEM TO BE SOLVED: To provide a device for supporting a substrate adapted to obviate a processing-failure and an operation-failure of a substrate caused by particles created by friction between constituent members, and to provide a device for processing a substrate provided with the device for su...

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Bibliographic Details
Main Author KURATA YASUHIRO
Format Patent
LanguageEnglish
Published 05.06.2008
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Summary:PROBLEM TO BE SOLVED: To provide a device for supporting a substrate adapted to obviate a processing-failure and an operation-failure of a substrate caused by particles created by friction between constituent members, and to provide a device for processing a substrate provided with the device for supporting a substrate. SOLUTION: When a spin chuck 500 is to support a substrate W, a second linking member 702 and a first linking member 701 are operated and a force to provide lowering together with rotation (an arrow M3) acts on a supporting member 600a. Thereby, a tapered shaft surface 611 of the supporting member 600a abuts a tapered hole surface HT of a spin base 700, thereby causing an interspace between a lift shaft 605 and a member-inserting hole H to be closed by the tapered shaft surface 611. When a substrate W is to be released from the spin chuck 500, the second linking member 702 and the first linking member 701 are operated and a force to provide lifting together with rotation (an arrow N3) acts on the supporting member 600a. Thereby, the tapered shaft surface 611 of the supporting member 600a is lifted while rotated, entailing removal of the tapered shaft surface 611 of the supporting member 600a from the tapered hole surface HT of a spin base 700. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060316470