METHOD OF FORMING SEPARATE FORMED-ON-FOIL THIN-FILM CAPACITOR FOR EMBEDDING INSIDE PRINTED WIRING BOARDS OR ORGANIC SEMICONDUCTOR PACKAGES

PROBLEM TO BE SOLVED: To provide a method of forming a separate formed-on-foil thin-film capacitor for embedding inside printed wiring boards or organic semiconductor package substrates. SOLUTION: This invention is related to the method including a step to remove the selected portions of the capacit...

Full description

Saved in:
Bibliographic Details
Main Authors ONKEN MATTHEW T, MCGREGOR DAVID ROSS, AMEY DANIEL I JR, BORLAND WILLIAM
Format Patent
LanguageEnglish
Published 08.05.2008
Subjects
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a method of forming a separate formed-on-foil thin-film capacitor for embedding inside printed wiring boards or organic semiconductor package substrates. SOLUTION: This invention is related to the method including a step to remove the selected portions of the capacitor by sandblasting or other means so that a ceramic dielectric may not contact acid etching liquid. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070208244