BUMP ELECTRODE PROVIDED WITH PLATED LAYER, AND MANUFACTURING METHOD THEREFOR

• Main Authors: LEE CHUNG-SUN, KANG UN-BYOUNG, KWON WOON-SEONG, JANG HYANG-SUN, KWON YONG-HWAN
• Format: Patent
• Language: English
• Published: 24.04.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a bump electrode provided with a plated layer, and its manufacturing method. SOLUTION: This manufacturing method for the bump electrode includes steps of providing a substrate provided with a pad electrode, forming a seed layer on the pad electrode, forming a mask la...