BUMP ELECTRODE PROVIDED WITH PLATED LAYER, AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a bump electrode provided with a plated layer, and its manufacturing method. SOLUTION: This manufacturing method for the bump electrode includes steps of providing a substrate provided with a pad electrode, forming a seed layer on the pad electrode, forming a mask la...

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Bibliographic Details
Main Authors LEE CHUNG-SUN, KANG UN-BYOUNG, KWON WOON-SEONG, JANG HYANG-SUN, KWON YONG-HWAN
Format Patent
LanguageEnglish
Published 24.04.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a bump electrode provided with a plated layer, and its manufacturing method. SOLUTION: This manufacturing method for the bump electrode includes steps of providing a substrate provided with a pad electrode, forming a seed layer on the pad electrode, forming a mask layer comprising openings aligned on the pad electrode on the seed layer, electroplating a barrier plated layer on the seed layer in the opening, electroplating a bump plated layer on the barrier plated layer; removing the mask layer, and etching the seed layer with the bump-plated layer as a mask. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070263558