ACCELERATION SENSOR MANUFACTURING SUBSTRATE, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To carry out an anode junction stably in a surface protection cover glass. SOLUTION: An anode junction electrode terminal 8 comes into contact with a wafer substrate 1 through an opening 5c for an anode junction electrode terminal, and is connected to an anode junction internal...

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Bibliographic Details
Main Authors HARUKI TORU, MIYAKE HIDEJI, NISHIHARA KENJI, SAGAWA KOICHI
Format Patent
LanguageEnglish
Published 24.04.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To carry out an anode junction stably in a surface protection cover glass. SOLUTION: An anode junction electrode terminal 8 comes into contact with a wafer substrate 1 through an opening 5c for an anode junction electrode terminal, and is connected to an anode junction internal electrode 6b of an internal region through the wafer substrate 1. Upon the anode junction, a voltage is applied from the anode junction electrode terminal 8 to the anode junction internal electrode 6b through the wafer substrate 1. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060278673