SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To reduce contact resistance between a resistor and a wiring layer by directly connecting them on an insulation layer. SOLUTION: In the semiconductor device, a resistor 25 made of a titanium nitride (TiN) film is directly connected with wiring layers 28 and 29 on an insulation...

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Main Authors ONE NAOKI, SATO YOSHINORI, YAMAMAE TAKESHI
Format Patent
LanguageEnglish
Published 24.04.2008
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Abstract PROBLEM TO BE SOLVED: To reduce contact resistance between a resistor and a wiring layer by directly connecting them on an insulation layer. SOLUTION: In the semiconductor device, a resistor 25 made of a titanium nitride (TiN) film is directly connected with wiring layers 28 and 29 on an insulation layer 26. Thanks to such a structure, an contact area between the resistor 25 and the wiring layers 28 and 29 is increased and the contact resistance is reduced. Furthermore, a clearance L1 between the resistsor 25 and an epitaxial layer 3 is enlarged to reduce the parasitic capacitance in the resistor 25 and improve the high-frequency characteristic of the semiconductor device. COPYRIGHT: (C)2008,JPO&INPIT
AbstractList PROBLEM TO BE SOLVED: To reduce contact resistance between a resistor and a wiring layer by directly connecting them on an insulation layer. SOLUTION: In the semiconductor device, a resistor 25 made of a titanium nitride (TiN) film is directly connected with wiring layers 28 and 29 on an insulation layer 26. Thanks to such a structure, an contact area between the resistor 25 and the wiring layers 28 and 29 is increased and the contact resistance is reduced. Furthermore, a clearance L1 between the resistsor 25 and an epitaxial layer 3 is enlarged to reduce the parasitic capacitance in the resistor 25 and improve the high-frequency characteristic of the semiconductor device. COPYRIGHT: (C)2008,JPO&INPIT
Author SATO YOSHINORI
YAMAMAE TAKESHI
ONE NAOKI
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RelatedCompanies SANYO ELECTRIC CO LTD
SANYO SEMICONDUCTOR CO LTD
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Snippet PROBLEM TO BE SOLVED: To reduce contact resistance between a resistor and a wiring layer by directly connecting them on an insulation layer. SOLUTION: In the...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
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