MULTILAYER WIRING CIRCUIT BOARD, MULTILAYER WIRING CIRCUIT BOARD STRUCTURE

• Main Authors: HIRANO SATOSHI, SHIMOGAMI KOICHIRO, HIGO ICHIEI
• Format: Patent
• Language: English
• Published: 24.04.2008
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a multilayer wiring circuit board for improving heat radiation property, preventing warpage of the board through improvement in rigidity, and assuring reduction in thickness and high degree of freedom in design of wiring. SOLUTION: The multilayer wiring circuit board...