MULTILAYER WIRING CIRCUIT BOARD, MULTILAYER WIRING CIRCUIT BOARD STRUCTURE

PROBLEM TO BE SOLVED: To provide a multilayer wiring circuit board for improving heat radiation property, preventing warpage of the board through improvement in rigidity, and assuring reduction in thickness and high degree of freedom in design of wiring. SOLUTION: The multilayer wiring circuit board...

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Bibliographic Details
Main Authors HIRANO SATOSHI, SHIMOGAMI KOICHIRO, HIGO ICHIEI
Format Patent
LanguageEnglish
Published 24.04.2008
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a multilayer wiring circuit board for improving heat radiation property, preventing warpage of the board through improvement in rigidity, and assuring reduction in thickness and high degree of freedom in design of wiring. SOLUTION: The multilayer wiring circuit board 11 is provided with metal wiring layers 51 to 56 and bonded insulating layers 61 to 65. The metal wiring layers 51 to 56 include a metal conductor part 73 extending in the flat surface direction and the bonded insulating layers 61 to 65 have a via conductor 85. The metal wiring layers 51 to 56 are joined with each other via the bonded insulating layers 61 to 65 and the metal conductor part 73 belonging to different metal wiring layers 51 to 56 is electrically connected with each other via a via conductor 85. The metal wiring layers 51 to 56 are formed thicker than the bonded insulating layers 61 to 65. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060274431