HALOGEN-FREE CIRCUIT BOARD WHEREIN THERMAL EXPANSION IS REDUCED, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a circuit board which is capable of adapting to current manufacturing procedure, and produces a product with reduced cost by utilizing a new insulating layer defined in this specification and establishing further-simplified usage. SOLUTION: A composite layer provided...

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Bibliographic Details
Main Authors JAPP ROBERT M, MARKOVICH VOYA R, PAPATHOMAS KOSTAS I
Format Patent
LanguageEnglish
Published 17.04.2008
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a circuit board which is capable of adapting to current manufacturing procedure, and produces a product with reduced cost by utilizing a new insulating layer defined in this specification and establishing further-simplified usage. SOLUTION: A composite layer provided with a first insulating layer comprised of halogen-free resin and fiber dispersed therein and a second insulating layer which contains inorganic particles, the halogen-free resin and no fiber, is included. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070257049