ELECTRONIC CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To dispense with a case for packing a potting material for an electronic circuit device of small size and low cost, in which a semiconductor element such as an IPM (intelligent power module) used for an inverter control device or the like is mounted on a circuit board and is fi...

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Bibliographic Details
Main Author TOKUNAGA SHIGEOMI
Format Patent
LanguageEnglish
Published 10.04.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract PROBLEM TO BE SOLVED: To dispense with a case for packing a potting material for an electronic circuit device of small size and low cost, in which a semiconductor element such as an IPM (intelligent power module) used for an inverter control device or the like is mounted on a circuit board and is filled with an insulating potting material. SOLUTION: A vertical subboard 53 on which an IPM51 which is an SIP type semiconductor element and a microcomputer 61a which is a control semiconductor element are mounted, and a bushing 57 are housed and fitted inside a heatsink 59. A potting material 64 is packed inside the heatsink 59 which is divided with the bushing 57, and the vertical subboard 53 and the heatsink 59 are mounted on a main board 67, eliminating the need for a case in which the potting material 64 is packed. COPYRIGHT: (C)2008,JPO&INPIT
AbstractList PROBLEM TO BE SOLVED: To dispense with a case for packing a potting material for an electronic circuit device of small size and low cost, in which a semiconductor element such as an IPM (intelligent power module) used for an inverter control device or the like is mounted on a circuit board and is filled with an insulating potting material. SOLUTION: A vertical subboard 53 on which an IPM51 which is an SIP type semiconductor element and a microcomputer 61a which is a control semiconductor element are mounted, and a bushing 57 are housed and fitted inside a heatsink 59. A potting material 64 is packed inside the heatsink 59 which is divided with the bushing 57, and the vertical subboard 53 and the heatsink 59 are mounted on a main board 67, eliminating the need for a case in which the potting material 64 is packed. COPYRIGHT: (C)2008,JPO&INPIT
Author TOKUNAGA SHIGEOMI
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Snippet PROBLEM TO BE SOLVED: To dispense with a case for packing a potting material for an electronic circuit device of small size and low cost, in which a...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title ELECTRONIC CIRCUIT DEVICE
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