ELECTRONIC CIRCUIT DEVICE
PROBLEM TO BE SOLVED: To dispense with a case for packing a potting material for an electronic circuit device of small size and low cost, in which a semiconductor element such as an IPM (intelligent power module) used for an inverter control device or the like is mounted on a circuit board and is fi...
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Main Author | |
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Format | Patent |
Language | English |
Published |
10.04.2008
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To dispense with a case for packing a potting material for an electronic circuit device of small size and low cost, in which a semiconductor element such as an IPM (intelligent power module) used for an inverter control device or the like is mounted on a circuit board and is filled with an insulating potting material. SOLUTION: A vertical subboard 53 on which an IPM51 which is an SIP type semiconductor element and a microcomputer 61a which is a control semiconductor element are mounted, and a bushing 57 are housed and fitted inside a heatsink 59. A potting material 64 is packed inside the heatsink 59 which is divided with the bushing 57, and the vertical subboard 53 and the heatsink 59 are mounted on a main board 67, eliminating the need for a case in which the potting material 64 is packed. COPYRIGHT: (C)2008,JPO&INPIT |
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Bibliography: | Application Number: JP20060264052 |