APPARATUS AND METHOD FOR INSPECTING SUBSTRATE SHAPE FOR ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF SUBSTRATE FOR MASK BLANK

• Main Author: TOCHIHARA YASUTAKA
• Format: Patent
• Language: English
• Published: 03.04.2008
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PROBLEM TO BE SOLVED: To provide an apparatus for inspecting a substrate shape for an electronic device that can inspect an evaluation item related to a substrate for the electronic device by one measurement, and to provide high measurement accuracy of in a non-contact manner with the substrate. SOLUTION: This device comprises a shape detecting means 1 for optically detecting the shape of the substrate for the electronic device, a shape information processing means 5 for applying image processing to the detected shape information as necessary, a shape measuring means 6 for measuring the shape of the substrate based on the detected shape information or the shape information to which the image processing is applied. The shape detecting means 1 has a light receiving section, and an optical member is interposed in an optical path so that light having passed at least a measured part of the substrate is reflected and is returned to the light receiving section again. COPYRIGHT: (C)2008,JPO&INPIT