ADHESIVE COMPOSITION, AND FILM ADHESIVE AND CIRCUIT CONNECTION MATERIAL PRODUCED BY USING THE SAME

PROBLEM TO BE SOLVED: To provide an adhesive composition having quick curability at low temperature and excellent connection property. SOLUTION: The adhesive composition comprises (A) a polyurethane imide expressed by general formula (I), (B) a modified polyurethane expressed by general formula (II)...

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Bibliographic Details
Main Authors KATAYAMA EMI, SUGIURA MINORU
Format Patent
LanguageEnglish
Published 28.02.2008
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
CONDUCTORS
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide an adhesive composition having quick curability at low temperature and excellent connection property. SOLUTION: The adhesive composition comprises (A) a polyurethane imide expressed by general formula (I), (B) a modified polyurethane expressed by general formula (II) and (C) a radical polymerization initiator. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060305487