LIGHT-EMITTING ELEMENT PACKAGE, AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a light-emitting element package capable of radiating uniform white light, and to provide a method for manufacturing the same. SOLUTION: The light-emitting element package is configured by providing a package body, an electrode formed on at least one side of the pack...

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Bibliographic Details
Main Authors KIM GEUN-HO, WON YU HO, SONG KIANG, PARK CHIL KEUN
Format Patent
LanguageEnglish
Published 21.02.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a light-emitting element package capable of radiating uniform white light, and to provide a method for manufacturing the same. SOLUTION: The light-emitting element package is configured by providing a package body, an electrode formed on at least one side of the package body, a light-emitting element mounted on the package body, and a phosphor layer that covers the light-emitting element in a uniform thickness. The system can improve a color coordinate uniformity at each position of the light emitting elements and irradiate the light where a wavelength is uniformly converted, because the light irradiated from the light-emitting element is allowed to be emitted through an external medium while minimizing optical path differences. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20070206625