DRAWING METHOD AND DRAWING APPARATUS

• Main Authors: SHIRASAKI SUSUMU, NAKADA KEISUKE, SATO SHINICHIRO, UENO HIROYUKI
• Format: Patent
• Language: English
• Published: 14.02.2008
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PROBLEM TO BE SOLVED: To reduce the frequency of maintenance required for a discharge head. SOLUTION: The drawing method comprises: a drawing step for drawing a pattern of wiring 103 on a drawing area by discharging droplets from a discharge intended nozzle assigned corresponding to the pattern of the wiring 103 in a plurality of nozzles formed to be arranged in the X-direction while moving forth and back the nozzles in the Y-direction in a state of facing the drawing area 51 on a substrate 13; and a repeatedly drawing step for repeatedly drawing the pattern of the wiring 103 on a novel drawing area 51. In the repeatedly drawing step, the position of the novel drawing area 51 in the X-direction is shifted from the position of the drawing area 51 in the previous drawing step and the novel discharge intended nozzle is assigned to be shifted along the X-direction corresponding to the shift between the position of the novel drawing area 51 in the repeatedly drawing step and the position of the drawing area 51 in the previous drawing step and the droplets are discharged from the novel discharge intended nozzle. COPYRIGHT: (C)2008,JPO&INPIT