COOLING PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a cooling processing apparatus capable of preventing transfer of a metal contamination substances or particles between substrates. SOLUTION: A first ceramic plate 20, formed of a ceramic having emissivity and thermal conductivity that is larger than that of quartz is...

Full description

Saved in:
Bibliographic Details
Main Author NISHIHARA HIDEO
Format Patent
LanguageEnglish
Published 07.02.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a cooling processing apparatus capable of preventing transfer of a metal contamination substances or particles between substrates. SOLUTION: A first ceramic plate 20, formed of a ceramic having emissivity and thermal conductivity that is larger than that of quartz is formed on a bottom cooling plate 10, having a temperature kept at a predetermined value by the cooling water supplied from a cooling water supply source 15. Support members 50 are erected and provided at three or more portions on the upper surface of the first ceramic plate 20. Push-up pins 31, having received heated a semiconductor wafer W that has moved downward and are embedded in the through holes of the first ceramic plate 20; and thus, the semiconductor wafer W approximates the first ceramic plate 20 in point contact by the support members 50, and are supported and cooled. Since the semiconductor wafer W is supported at point contact by the support members 50, the metal contaminated substance etc. can be prevented from transferring among semiconductor wafers W. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060200706