MANUFACTURING METHOD OF LAMINATE OF PLASTIC FILM-CONDUCTOR METAL FOIL

PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminate of plastic film-conductor metal foil that can be suitably used for the production of circuit tapes for TAB and the like, excels in heat resistance and dimensional stability, and is extremely reduced in the soiling on the surface o...

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Bibliographic Details
Main Author SHIMOSE MAKOTO
Format Patent
LanguageEnglish
Published 24.01.2008
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Summary:PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminate of plastic film-conductor metal foil that can be suitably used for the production of circuit tapes for TAB and the like, excels in heat resistance and dimensional stability, and is extremely reduced in the soiling on the surface of the conductor metal foil. SOLUTION: The manufacturing method of the laminate of plastic film-conductor metal foil comprises forming the adhesive agent layer 4 on the plastic film, performing the perforation and then gluing the conductor metal foil 6 on the plastic film through the adhesive agent layer 4. The gluing of the conductor metal foil 6 comprises at least two processes: the temporary bonding process wherein the conductor metal foil 6 is temporarily bonded to the plastic film 3; and the heat curing process wherein the adhesive agent layer 4 is heat cured. The heat curing process is characterized in that the heat curing of the adhesive agent layer is performed in the state in which the plastic film temporarily bonded with the conductor metal foil 6 is wound together with an accompanying metal foil. COPYRIGHT: (C)2008,JPO&INPIT
Bibliography:Application Number: JP20060186819