SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

• Main Authors: USHIDA FUMIO, YOSHIDA MIKI, OZAKI YASUTAKA, NAORI NOBUHISA
• Format: Patent
• Language: English
• Published: 10.01.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device which is capable of restraining an adverse effect from being imposed on processes that are carried out after a symbol pattern is formed. SOLUTION: Two or more device patterns constituting a part of an electronic circuit have been formed on the surface of a substrate. A symbol pattern serving as an identification mark is formed in the same layer as the device patterns. The width of the device pattern stays within a prescribed range. The symbol pattern is composed of two or more separate component patterns. The component patterns are represented by rectilinear patterns or dotted patterns. The width of the component pattern is 0.8 times or above as large as the lower limit of the prescribed range of the width of the device pattern and 1.2 times or below as large as the upper limit. COPYRIGHT: (C)2008,JPO&INPIT